NEWS 16 February 2021

Agile systems engineering approach towards high-throughput 3D metrology equipment for semiconductor process control

In the semiconductor industry, Moore’s law comes with increasing and complex demands and the need for advanced process control metrology. Nearfield Instruments fulfils these needs with their high-throughput scanning probe...


In the semiconductor industry, Moore’s law comes with increasing and complex demands and the need for advanced process control metrology. Nearfield Instruments fulfils these needs with their high-throughput scanning probe metrology (HT-SPM) systems. January 2018, they started working on their first product, QUADRA. By rigorously adhering to an agile systems engineering methodology and promoting the concept of a minimum viable product, as described in this Mikroniek article, Nearfield Instruments was able to develop, integrate, test, and subsequently ship their first QUADRA to a major semiconductor fab in December 2020.


References

YPN visit to JPE

From the ins and outs of a cold chopper for astronomy to the latest developments in nanopositioning systems, YPN’s visit to JPE on 6 June was a unique opportunity to learn all about their impressive projects in custom system design.

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First ECP2 Silver certificate lays…

Recently, the first ECP2 Silver certificate was awarded. ECP2 is the European certified precision engineering course programme that emerged from a collaboration between euspen and DSPE.

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DSPE appoints Martin van den…

Upon his retirement from ASML, Martin van den Brink was appointed honorary member of DSPE.

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