NEWS 13 August 2020

Mikroniek June issue: Precision Mechatronics

The June issue of Mikroniek, click here for a first impression, features the theme of Precision Mechatronics. In part dedicated to the fourth DSPE Conference on Precision Mechatronics, it comprises...


The June issue of Mikroniek, click here for a first impression, features the theme of Precision Mechatronics. In part dedicated to the fourth DSPE Conference on Precision Mechatronics, it comprises the conference programme, the abstracts of all papers and an overview of the posters and demos. Design stories in this issue feature a high-speed RFID die bonder for low-cost label production and a clean z-mechanism for a wafer handler robot wrist assembly. Other contributions include nanophotonics enabling a spectrometer on a chip and the euspen Conference report.

 

Please send an e-mail for information on how to obtain a hardcopy of the June edition.

 

 


References

YPN visit to JPE

From the ins and outs of a cold chopper for astronomy to the latest developments in nanopositioning systems, YPN’s visit to JPE on 6 June was a unique opportunity to learn all about their impressive projects in custom system design.

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First ECP2 Silver certificate lays…

Recently, the first ECP2 Silver certificate was awarded. ECP2 is the European certified precision engineering course programme that emerged from a collaboration between euspen and DSPE.

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DSPE appoints Martin van den…

Upon his retirement from ASML, Martin van den Brink was appointed honorary member of DSPE.

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