NEWS 13 August 2020

Mikroniek October: DSPE Conference report, Precision Fair 2016 preview, and Additive Manufacturing focus

The October issue of Mikroniek, click here for a first impression, which has recently appeared, is loaded with information. It contains a report of the DSPE Conference on Precision Mechatronics...

The October issue of Mikroniek, click here for a first impression, which has recently appeared, is loaded with information. It contains a report of the DSPE Conference on Precision Mechatronics 2016 as well as a preview of the Precision Fair 2016. The theme of this issue is Additive Manufacturing, focussing on the industrial applications of 3D (metal) printing. A feature article is dedicated to the system architecture of the next generation die bonders of NXP ITEC; a redesign introduced a short stroke / long stroke wafer table with balance-mass functionality. 

Please send an e-mail for information on how to obtain a hardcopy.

References

YPN visit to JPE

From the ins and outs of a cold chopper for astronomy to the latest developments in nanopositioning systems, YPN’s visit to JPE on 6 June was a unique opportunity to learn all about their impressive projects in custom system design.

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First ECP2 Silver certificate lays…

Recently, the first ECP2 Silver certificate was awarded. ECP2 is the European certified precision engineering course programme that emerged from a collaboration between euspen and DSPE.

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DSPE appoints Martin van den…

Upon his retirement from ASML, Martin van den Brink was appointed honorary member of DSPE.

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