NEWS 14 December 2023

Model-based modular redesign with system-level guarantees

Complex mechatronic systems are often developed by multiple engineering teams, each responsible for parts (modules) of the system (re)design.


These teams face the challenge of jointly warranting the satisfaction of system-level specifications. To address this challenge, a modular approach is proposed. This allows for parallel (re)design cycles for each module, simplifying the design process and reducing overall development time. This Mikroniek article presents a model-based, modular redesign framework for mechatronic systems. The framework is illustrated on a model of an industrial wire bonder, showing possible redesigns of the wire-bonder modules while guaranteeing original system-level specifications. (Image courtesy of TU/e)


References

YPN visit to JPE

From the ins and outs of a cold chopper for astronomy to the latest developments in nanopositioning systems, YPN’s visit to JPE on 6 June was a unique opportunity to learn all about their impressive projects in custom system design.

Read more
First ECP2 Silver certificate lays…

Recently, the first ECP2 Silver certificate was awarded. ECP2 is the European certified precision engineering course programme that emerged from a collaboration between euspen and DSPE.

Read more
DSPE appoints Martin van den…

Upon his retirement from ASML, Martin van den Brink was appointed honorary member of DSPE.

Read more