NEWS 12 January 2019

Mikroniek: Wafer-handler systems engineering and magnetic bearing design

A systems engineering approach to the design of a wafer handler is presented in this Mikroniek article, starting with an introduction to wafer handling, followed by the corresponding requirements and...


A systems engineering approach to the design of a wafer handler is presented in this Mikroniek article, starting with an introduction to wafer handling, followed by the corresponding requirements and lastly common system architectures. Regarding wafer-handling robots, the conclusion is that the moving robot mass increases when contamination requirements become more stringent. Moreover, robotic concepts containing a linear stroke can improve stiffness and reduce mass at the cost of contamination-sealing complexity. To conclude, the design and realisation of a low-end, low-cost magnetic bearing for high-cleanliness robotic applications is discussed.


References

YPN visit to JPE

From the ins and outs of a cold chopper for astronomy to the latest developments in nanopositioning systems, YPN’s visit to JPE on 6 June was a unique opportunity to learn all about their impressive projects in custom system design.

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First ECP2 Silver certificate lays…

Recently, the first ECP2 Silver certificate was awarded. ECP2 is the European certified precision engineering course programme that emerged from a collaboration between euspen and DSPE.

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DSPE appoints Martin van den…

Upon his retirement from ASML, Martin van den Brink was appointed honorary member of DSPE.

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