Resultaten, Glasvezel-chip koppeling

In de telecommunicatiesector is het gebruik van glasvezel niet meer weg te denken. Maar de prijs van opto-elektronische devices is hoog, omdat de koppeling tussen glasvezel en de optische uitgangen van de chip relatief veel tijd kost. De Technische Universiteiten van Delft en Eindhoven onderzochten twee verschillende interconnectietechnologieën. Voor beide bestaat belangstelling.

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References

Order of frictions and stiffnesses…

For lumped systems consisting of different frictions and stiffnesses, there has been confusion in literature about hysteresis curves and virtual play for many decades.

Make it clean

In mid-April, the second edition of the Manufacturing Technology Conference and the fifth edition of the Clean Event were held together, for the first time, at the Koningshof in Veldhoven (NL).

Bringing particles to light

Particle contamination monitoring and cleanliness control are fundamental to micromanufacturing processes across diverse industries to achieve cost-effective production of high-quality and reliable microscale devices and components.